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Semiconductor Grade Clean Component Sulfuric Acid Anodizing Line for High-Purity Aluminum Substrates

Semiconductor Grade Clean Component Sulfuric Acid Anodizing Line for High-Purity Aluminum Substrates

Brand Name: MEL-AL
Model Number: MEL-AL-1018
MOQ: 1set
Price: Customized Price
Packaging Details: Standard Packaging
Payment Terms: L/C,T/T
Detail Information
Place of Origin:
Foshan, China
Control Power:
AC220V 50Hz
Highlight:

Semiconductor grade sulfuric acid anodizing line

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High-purity aluminum substrate anodizing line

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Clean component anodizing production line

Product Description
Semiconductor Grade Clean Component Sulfuric Acid Anodizing Line for High-Purity Aluminum Substrates
Overview

This fully automatic clean-type sulfuric acid anodizing line is engineered exclusively for high-purity aluminum semiconductor components. It produces uniform 8-15 μm natural clear oxide film without metallic salt dyeing contamination. The line supports hot water sealing or medium-temperature nickel-free sealing to meet strict semiconductor cleanliness and outgassing requirements.

Technical Specifications
Item Parameter
Applicable Workpiece Semiconductor clean components, high-purity aluminum substrates
Anodizing Type Low contamination sulfuric acid decorative anodizing
Oxide Film Thickness 8-15 μm
Surface Appearance Natural clear finish (no metallic salt coloring, zero ion contamination risk)
Sealing Options Hot water sealing / Medium-temperature nickel-free sealing
Operation Mode Fully automatic clean anodizing line
Cleanliness Control Low-ion bath formulation, dedicated clean circulation & filtration system
Key Restriction Dyeing process prohibited to avoid heavy metal contamination
Process Flow
  1. Degreasing (low-surfactant clean degreasing)
  2. Multi-stage pure water rinsing
  3. Mild desmut treatment
  4. High-purity sulfuric acid anodizing
  5. Continuous ultra-pure water cascade rinsing
  6. Sealing: Hot water sealing / Medium-temperature nickel-free sealing
  7. Final pure water rinsing
  8. Controlled low-temperature drying
Core Advantages
  • Fully automatic running mode ensures consistent film thickness within 8-15 μm across batches
  • Metallic salt dyeing is eliminated to prevent ionic pollution that affects semiconductor performance
  • Supports nickel-free sealing solutions, complying with semiconductor industry environmental and outgassing standards
  • Equipped with high-precision continuous filtration & ultra-pure water supply to maintain bath cleanliness
  • Strictly controlled rinsing cascades minimize residual acid and foreign particle carryover
Supporting Equipment
  • Pre-treatment tank group
  • High-purity sulfuric acid anodizing tank
  • Multi-stage UPW rinsing system
  • Sealing tank (hot water / nickel-free medium-temperature sealing)
  • DC anodizing rectifier
  • High-precision circulation filter system
  • Clean low-temperature drying oven
  • Waste gas & wastewater treatment unit
  • PLC automatic gantry crane & central control system
Frequently Asked Questions
Q1: Why metallic salt coloring is forbidden for semiconductor aluminum parts?

Metal ions from colorants may remain inside the oxide film, causing ion migration, contamination and reliability risks for semiconductor assemblies. Natural clear anodizing is adopted.

Q2: What is the difference between nickel-free sealing and conventional nickel-containing sealing?

Medium-temperature nickel-free sealing avoids nickel ion residue. It satisfies semiconductor requirements for low outgassing and heavy-metal-free surfaces.

Q3: Is the line available for small batch trial production?

The main configuration is fully automatic for mass production; a semi-automatic / manual clean module can be supplied as an optional upgrade for sampling orders.

Contact us for customized layout design and quotation.